- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/66 - Structural association with built-in electrical component
Patent holdings for IPC class H01R 13/66
Total number of patents in this class: 3787
10-year publication summary
|
323
|
392
|
418
|
467
|
474
|
381
|
319
|
274
|
274
|
84
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| TE Connectivity Solutions GmbH | 2580 |
90 |
| Yazaki Corporation | 6282 |
75 |
| Apple Inc. | 50209 |
72 |
| Foxconn Interconnect Technology Limited | 1034 |
68 |
| Samsung Electronics Co., Ltd. | 131630 |
52 |
| Sumitomo Wiring Systems, Ltd. | 9367 |
52 |
| CommScope Technologies LLC | 4937 |
52 |
| Hubbell Incorporated | 3052 |
41 |
| Molex, LLC | 1792 |
41 |
| Phoenix Contact E-mobility GmbH | 159 |
41 |
| Panduit Corp. | 1007 |
38 |
| Robert Bosch GmbH | 40953 |
35 |
| Aptiv Technologies AG | 2097 |
32 |
| Eaton Intelligent Power Limited | 6113 |
31 |
| Hon Hai Precision Industry Co., Ltd. | 4157 |
30 |
| Sumitomo Electric Industries, Ltd. | 14131 |
28 |
| 3m Innovative Properties Company | 18406 |
27 |
| CommScope, Inc. of North Carolina | 647 |
26 |
| Cisco Technology, Inc. | 18858 |
24 |
| AutoNetworks Technologies, Ltd. | 5809 |
24 |
| Other owners | 2908 |